LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape application platform and processes therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Tape attachment chip-on-board assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape automated bonded (TAB) circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape automated bonding (TAB) semiconductor device with ground pl

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape automated bonding (tab) tapes having underlying camber supp

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape automated bonding film

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Tape automated bonding method and bonded structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Tape automated bonding package for a semiconductor chip employin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape automated bonding type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Tape automated bonding(tab)semiconductor device and method for m

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Tape ball grid array package with electromagnetic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Tape ball grid array semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Tape ball grid array with interconnected ground plane

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Tape ball lead integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape carrier and assembly structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape carrier and tape carrier device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Tape carrier and tape carrier device using the same