Tape ball grid array package with electromagnetic...

Details Tape ball grid array package with electromagnetic... Tape ball grid array package with electromagnetic...

2006-07-04

2006-07-04

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S707000, C257S778000

Reexamination Certificate

active

07071556

ABSTRACT:
A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.

REFERENCES:
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5843808 (1998-12-01), Karnezos
patent: 6469897 (2002-10-01), Ho et al.
patent: 6483187 (2002-11-01), Chao et al.
patent: 2002/0063331 (2002-05-01), Honda
patent: WO 98/25301 (1998-06-01), None

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