Tape attachment chip-on-board assemblies

Details Tape attachment chip-on-board assemblies Tape attachment chip-on-board assemblies

2006-06-13

2006-06-13

Kang, Donghee (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257S783000, C257S784000, C257S787000, C438S118000, C438S124000, C438S127000, C361S707000, C361S708000, C361S709000, C361S710000

Reexamination Certificate

active

07061119

ABSTRACT:
An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a corresponding semiconductor substrate surface by providing an adhesive tape which extends across areas of contact between the semiconductor die active surface and the semiconductor substrate. The present invention also includes extending the adhesive tape beyond the areas of contact between the semiconductor die active surface and the semiconductor substrate to provide a visible surface of visual inspection of proper adhesive tape placement.

REFERENCES:
patent: 4363076 (1982-12-01), McIver
patent: 4692943 (1987-09-01), Pietzsch et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5466888 (1995-11-01), Beng et al.
patent: 5536765 (1996-07-01), Papathomas
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5548091 (1996-08-01), DiStefano et al.
patent: 5571594 (1996-11-01), Minowa et al.
patent: 5594282 (1997-01-01), Otsuki
patent: 5600183 (1997-02-01), Gates, Jr.
patent: 5612569 (1997-03-01), Murakami et al.
patent: 5633529 (1997-05-01), Otsuki
patent: 5656862 (1997-08-01), Papathomas et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5733800 (1998-03-01), Moden
patent: 5776796 (1998-07-01), Distefano et al.
patent: 5784782 (1998-07-01), Boyko et al.
patent: 5817545 (1998-10-01), Wang et al.
patent: 5818698 (1998-10-01), Corisis
patent: 6013946 (2000-01-01), Lee et al.
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049129 (2000-04-01), Yew et al.
patent: 6175159 (2001-01-01), Sasaki
patent: 6198162 (2001-03-01), Corisis
patent: 6249052 (2001-06-01), Lin
patent: 6252298 (2001-06-01), Lee et al.
patent: 6326700 (2001-12-01), Bai et al.
patent: 6331453 (2001-12-01), Bolken et al.
patent: 0967647 (1999-12-01), None
patent: 9-92775 (1997-04-01), None
patent: 97/01865 (1997-01-01), None
patent: WO97/01865 (1997-01-01), None

Affiliated with

Also associated with

Rating

Tape attachment chip-on-board assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape attachment chip-on-board assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape attachment chip-on-board assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3707433