Tape automated bonding package for a semiconductor chip employin

Details Tape automated bonding package for a semiconductor chip employin Tape automated bonding package for a semiconductor chip employin

1995-01-05

2000-02-01

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257668, 257669, 257671, H01L 2348, H01L 2350, H01L 2952

Patent

active

060206306

ABSTRACT:
A semiconductor package (80) is provided that serves to support a semiconductor chip (12). A radial slot (54) is formed in an inner ring (26). Cross-slots (64) and (66) are formed in a corner member (38) of polyimide film (22). The slots (54), (64) and (66) serve to allow independent expansion of various portions of the polyimide film (22) and prevent breakage of contact leads (14), (16), (18) and (20) due to the differences in the thermal coefficient of expansion of the semiconductor material and the polyimide film material.

REFERENCES:
patent: 5008614 (1991-04-01), Shreeve et al.
patent: 5229638 (1993-07-01), Ito
patent: 5336927 (1994-08-01), Suetake

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