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Selected: P

Power/ground metallization routing in a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular power supply distribution means
Reexamination Certificate

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Power/ground network of integrated circuits and arrangement...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Power/ground ring substrate for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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PRAMs having a plurality of active regions located...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
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PRAMS having phase-change layer pattern with electrode...

Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material
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Pre-back-grind and underfill layer for bumped wafers and dies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Pre-bond cavity air bridge

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Pre-bond encapsulation of area array terminated chip and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Pre-drilled ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Pre-encapsulated cavity interposer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Pre-finished leadframe for semiconductor devices and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Pre-molded clip structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Pre-molded leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
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Pre-molded leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Pre-molded, clip-bonded multi-die semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
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Pre-oxidizing high-dielectric-constant material electrodes

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Pre-oxidizing high-dielectric-constant material electrodes

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Pre-patterned substrate for organic thin film transistor...

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
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Preamplifier integrated circuit on flex circuit for magnetic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Precharge circuit and semiconductor storage device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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