Pre-patterned substrate for organic thin film transistor...

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material

Reexamination Certificate

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C438S099000

Reexamination Certificate

active

06946677

ABSTRACT:
Grooves in a desired circuit configuration are formed in the surface of a substrate to pre-pattern the area to receive material forming an organic thin film transistor (OTFT) structure and interconnecting conductive paths. The OTFT material is deposited in the pre-patterned area using printing techniques such as ink jet printing. In one embodiment, the grooves are formed in the surface substrate during the injection molding process of the substrate. Inter-exchangeable device covers carry different substrates to provide different functionalities of an electronic device with which the covers are used.

REFERENCES:
patent: 6476550 (2002-11-01), Oda et al.
patent: 6524884 (2003-02-01), Kim et al.
patent: 6603139 (2003-08-01), Tessler et al.
patent: 6630684 (2003-10-01), Lee et al.
patent: 6661034 (2003-12-01), Kawase

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