Pre-encapsulated cavity interposer

Details Pre-encapsulated cavity interposer Pre-encapsulated cavity interposer

2008-05-28

2011-12-06

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE21614, C257S686000, C257S723000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

08072082

ABSTRACT:
A pre-encapsulated cavity interposer, a pre-encapsulated frame, for a semiconductor device.

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