Pre-molded clip structure

Details Pre-molded clip structure Pre-molded clip structure

2011-08-30

2011-08-30

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23031, C257SE23036, C257SE23052, C257S684000, C257S796000, C257S666000, C257S696000, C257S670000, C257S672000, C257SE25031, C257SE25032, C257SE25020, C257SE25005, C257SE25011, C257SE25015

Reexamination Certificate

active

08008759

ABSTRACT:
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.

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