Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2011-03-01
2011-03-01
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S672000, C257S723000, C257S685000, C257SE25031, C257SE25032, C257SE23042, C257SE25005, C257SE25011, C257SE25015, C257SE25020, C257SE25026, C438S006000, C438S028000, C438S066000, C438S067000, C438S107000, C438S406000, C438S455000, C438S458000
Reexamination Certificate
active
07898067
ABSTRACT:
Semiconductor packages that contain multiple dies and methods for making such packages are described. The semiconductor packages contain a leadframe with multiple dies and also contain a single premolded clip that connects the dies. The premolded clip connects the solderable pads of the source die and gate die to the source and gate of the leadframe via standoffs. The solderable pads on the dies and on the standoffs provide a substantially planar surface to which the premolded clip is attached. Such a configuration increases the cross-sectional area of the interconnection when compared to wirebonded connections, thereby improving the electrical (RDSon) and the thermal performance of the semiconductor package. Such a configuration also lowers costs relative to similar semiconductor packages that use wirebonded connections. Other embodiments are described.
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Clark Jasmine J
Fairchild Semiconductor Corporaton
Horton Kenneth
Kirton & McConkie
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