Pre-molded, clip-bonded multi-die semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Reexamination Certificate

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Details

C257S672000, C257S723000, C257S685000, C257SE25031, C257SE25032, C257SE23042, C257SE25005, C257SE25011, C257SE25015, C257SE25020, C257SE25026, C438S006000, C438S028000, C438S066000, C438S067000, C438S107000, C438S406000, C438S455000, C438S458000

Reexamination Certificate

active

07898067

ABSTRACT:
Semiconductor packages that contain multiple dies and methods for making such packages are described. The semiconductor packages contain a leadframe with multiple dies and also contain a single premolded clip that connects the dies. The premolded clip connects the solderable pads of the source die and gate die to the source and gate of the leadframe via standoffs. The solderable pads on the dies and on the standoffs provide a substantially planar surface to which the premolded clip is attached. Such a configuration increases the cross-sectional area of the interconnection when compared to wirebonded connections, thereby improving the electrical (RDSon) and the thermal performance of the semiconductor package. Such a configuration also lowers costs relative to similar semiconductor packages that use wirebonded connections. Other embodiments are described.

REFERENCES:
patent: 6093961 (2000-07-01), McCullough
patent: 6624522 (2003-09-01), Standing et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 6784540 (2004-08-01), Cardwell
patent: 7332806 (2008-02-01), Joshi et al.
patent: 7838340 (2010-11-01), Cruz et al.
patent: 2005/0161785 (2005-07-01), Kawashima et al.
patent: 2007/0231968 (2007-10-01), Jacob et al.
patent: 2008/0197507 (2008-08-01), Yang
patent: 2009/0190320 (2009-07-01), Shimizu et al.
patent: 4-96356 (1992-03-01), None
User Guide for IR3820A Evaluation Board, International IR Rectifier, Rev. 0.0 Jan. 7, 2008, pp. 1-16, IRDC3820A.
Highly Integrated 14 A Wide-Input Voltage, Synchronous Buck Regulator, International IR Rectifier, Jan. 8, 2008, pp. 1-21, PD-60330, IR3820AMPbF.
FDMF6730 Driver plus FET Multi-chip Module, Fairchild Semiconductor Corporation, FDMF6730 Rev. D2, Aug. 2008, pp. 1-10.
6A, 24 V Input, Integrated Synchronous Buck Regulator, Fairchild Semiconductor Corporation, FAN2106-Tiny Buck Rev. 1.0.8, May 2008, pp. 1-14.

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