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Multi-chip assembly with optically coupled die

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate

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Multi-chip ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip ball grid array package and method of manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate

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Multi-chip circuit module and method for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Multi-chip configuration to connect flip-chips to flip-chips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Multi-chip device and method for producing a multi-chip device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip device and method of fabrication employing leads over

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Multi-chip device and method of fabrication employing leads over

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Multi-chip device utilizing a flip chip and wire bond assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip discrete devices in semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multi-chip electronic package and cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip electronic package and cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip electronic package and cooling system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Multi-chip image sensor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multi-chip image sensor module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Multi-chip integrated circuit carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Multi-chip integrated circuit module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip integrated circuit module for high-frequency...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

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Multi-chip integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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