Multi-chip electronic package and cooling system

Details Multi-chip electronic package and cooling system Multi-chip electronic package and cooling system

2005-12-13

2009-12-01

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S714000, C257S717000, C257SE25021, C257SE25027, C257SE23085, C257SE21614, C257SE25006, C257SE25013

Reexamination Certificate

active

07626252

ABSTRACT:
A multi-chip electronic package comprised of a plurality of integrated circuit chips secured together in a stack formation. The chip stack is hermetically sealed in an enclosure. The enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling the enclosed chip stack. A process and structure is proposed that allows for densely-packed, multi-chip electronic packages to be manufactured with improved heat dissipation efficiency, thus improving the performance and reliability of the multi-chip electronic package.

REFERENCES:
patent: 3247446 (1966-04-01), Krsek
patent: 3548915 (1970-12-01), Reading et al.
patent: 3548948 (1970-12-01), Reading et al.
patent: 3687737 (1972-08-01), Krock et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4389429 (1983-06-01), Soclof
patent: 4403238 (1983-09-01), Clark
patent: 4525921 (1985-07-01), Carson et al.
patent: 4561173 (1985-12-01), Te Velde
patent: 4617160 (1986-10-01), Belanger et al.
patent: 4706166 (1987-11-01), Go
patent: 4754316 (1988-06-01), Reid
patent: 4868712 (1989-09-01), Woodman
patent: 4962058 (1990-10-01), Cromin et al.
patent: 4963976 (1990-10-01), Fluegel et al.
patent: 5158986 (1992-10-01), Cha et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5202754 (1993-04-01), Bertin et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5235672 (1993-08-01), Carson
patent: 5241450 (1993-08-01), Bernhardt et al.
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5270572 (1993-12-01), Nakajima et al.
patent: 5296741 (1994-03-01), Kim
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5324684 (1994-06-01), Kermani et al.
patent: 5334356 (1994-08-01), Baldwin et al.
patent: 5336914 (1994-08-01), Andoh
patent: 5347428 (1994-09-01), Carson et al.
patent: 5405808 (1995-04-01), Rostoker et al.
patent: 5408742 (1995-04-01), Zaidel et al.
patent: 5444105 (1995-08-01), Ornstein
patent: 5457334 (1995-10-01), Nishimoto
patent: 5478781 (1995-12-01), Bertin et al.
patent: 5506753 (1996-04-01), Bertin et al.
patent: 5509468 (1996-04-01), Lopez
patent: 5510645 (1996-04-01), Fitch et al.
patent: 5578146 (1996-11-01), Grant et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5593926 (1997-01-01), Fujihira
patent: 5652462 (1997-07-01), Matsunaga et al.
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5737192 (1998-04-01), Linderman
patent: 5754405 (1998-05-01), Derouiche
patent: 5786628 (1998-07-01), Beilstein et al.
patent: 5807791 (1998-09-01), Bertin et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5898220 (1999-04-01), Ball
patent: 5907178 (1999-05-01), Baker et al.
patent: 5910682 (1999-06-01), Song
patent: 5936840 (1999-08-01), Satwinder
patent: 5994777 (1999-11-01), Farrar
patent: 6002177 (1999-12-01), Gaynes et al.
patent: 6008530 (1999-12-01), Kano
patent: 6014313 (2000-01-01), Hesselbom
patent: 6018616 (2000-01-01), Schaper
patent: 6025642 (2000-02-01), Burns
patent: 6077792 (2000-06-01), Farrar
patent: 6115242 (2000-09-01), Lambrecht
patent: RE36916 (2000-10-01), Moshayedi
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6134892 (2000-10-01), Turner et al.
patent: 6169325 (2001-01-01), Azuma et al.
patent: 6222737 (2001-04-01), Ross
patent: D459317 (2002-06-01), Fukumoto et al.
patent: 6410859 (2002-06-01), King
patent: 6489687 (2002-12-01), Hashimoto
patent: 6506981 (2003-01-01), Liberkowski
patent: 6686654 (2004-02-01), Farrar
patent: 6747347 (2004-06-01), Farrar et al.
patent: 2002/0053728 (2002-05-01), Isaak et al.
patent: 2002/0074637 (2002-06-01), McFarland
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2003/0015781 (2003-01-01), Farrar
patent: 2003/0020153 (2003-01-01), Bruce et al.
patent: 2003/0043543 (2003-03-01), Farrar et al.
patent: 2004/0207061 (2004-10-01), Farrar et al.
patent: 0 315 792 (1988-10-01), None
“The New Low-k Candidate: It's A Gas”; Semiconductor International; Mar. 1999, p. 38.
E. Jan Vardaman: “Future Packaging Trends: CSP vs. Flip Chip”; Proceedings of the 11thEuropean Microelectronics Conference; 1997; p. 295-99.
A.J. Blodgett and D.R. Barbour; “Thermal Conduction Module: A High-Performance MULTILAYER Ceramic Package”; IBM Journal of Research and Development, vol. 26, No. 1; Jan. 1982; pp. 30-36.

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