Multi-chip circuit module and method for producing the same

Details Multi-chip circuit module and method for producing the same Multi-chip circuit module and method for producing the same

2007-03-20

2007-03-20

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Housing or package filled with solid or liquid electrically...

C257S678000, C257S700000, C257S723000, C438S761000

Reexamination Certificate

active

10834542

ABSTRACT:
A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

REFERENCES:
patent: 5060045 (1991-10-01), Owada et al.
patent: 5231751 (1993-08-01), Sachdev et al.
patent: 5592735 (1997-01-01), Ozawa et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 6110806 (2000-08-01), Pogge
patent: 6156870 (2000-12-01), Morita et al.
patent: 6188127 (2001-02-01), Senba et al.
patent: 6459152 (2002-10-01), Tomita et al.
patent: 6535398 (2003-03-01), Moresco
patent: 6570469 (2003-05-01), Yamada et al.
patent: 6582991 (2003-06-01), Maeda et al.
patent: 6731010 (2004-05-01), Horiuchi et al.
patent: 6765299 (2004-07-01), Takahashi et al.
patent: 2000-299428 (2000-10-01), None
patent: 2001-168269 (2001-06-01), None
patent: 2001-291819 (2001-10-01), None
patent: 2002-170921 (2002-06-01), None

Affiliated with

Also associated with

Rating

Multi-chip circuit module and method for producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-chip circuit module and method for producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip circuit module and method for producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3802788