Multi-chip assembly with optically coupled die

Details Multi-chip assembly with optically coupled die Multi-chip assembly with optically coupled die

2009-06-12

2010-12-14

Wilson, Allan R (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

In combination with or also constituting light responsive...

C257S080000, C257SE33076, C257SE33077, C257SE31096

Reexamination Certificate

active

07851809

ABSTRACT:
Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

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