Multi-chip image sensor module

Details Multi-chip image sensor module Multi-chip image sensor module

2008-05-13

2008-05-13

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S704000, C257S737000, C257S723000, C257SE23001

Reexamination Certificate

active

11254659

ABSTRACT:
A multi-chip image sensor module includes a flexible module board, an image sensor chip, a transparent cover, and at least an IC chip. The flexible module board has a first die-attached portion, a second die-attached portion, at least one bent portion, and at least one bonding portion where the bent portion connects the first die-attached portion and the bonding portion. The image sensor chip is attached to the first die-attached portion and the IC chip is disposed on the second die-attached portion. Inner leads on the bonding portion are electrically connected to the bonding pads of the image sensor chip when the bonding portion is bonded on the image sensor chip. The transparent cover is disposed above the sensing area of the image sensor chip, preferably adhered to the bonding portion.

REFERENCES:
patent: 7061106 (2006-06-01), Yang et al.
patent: 2003/0001250 (2003-01-01), Chien-Hung et al.
patent: 484237 (2002-04-01), None
patent: 542493 (2003-07-01), None

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