Multi-chip discrete devices in semiconductor packages

Details Multi-chip discrete devices in semiconductor packages Multi-chip discrete devices in semiconductor packages

2008-05-05

2010-11-30

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S685000, C257SE23003, C257SE21505, C257S676000, C257S787000

Reexamination Certificate

active

07843048

ABSTRACT:
Semiconductor packages that contain multiple dies containing discrete devices and methods for making such devices are described. The semiconductor package contains both a first die containing transistor and second die containing a diode. The interconnect lead of the semiconductor package is connected to the bond pad of the transistor. At the same time, the interconnect lead contains a die attach pad for the diode. The result of this configuration is an integrated functional semiconductor device with a diminished footprint and decreased cost of manufacture. By using more than a single die containing a discrete device in a single semiconductor package, the device can also provide a wider variety of functions. Other embodiments are also described.

REFERENCES:
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U.S. Appl. No. 11/869,307.

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