Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-08-29
2006-08-29
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S686000
Reexamination Certificate
active
07098542
ABSTRACT:
A semiconductor structure includes a carrier having a cavity formed in a top portion thereof, and a plurality of conductive contacts formed on a top surface of the carrier and positioned around the periphery of the cavity. A number of first coplanar dice are back-side mounted to a top surface of the cavity, and a number of second coplanar dice are flip-chip mounted to the first dice, wherein each of the first dice is electrically connected to two corresponding adjacent second dice to connect the dice in a cascade configuration. For some embodiments, selected dice are flip-chip mounted to the carrier. For other embodiments, selected dice are wire-bond connected to the carrier.
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XILINX, INC., “The Programmable Logic Databook 1998,” pp 4-9 to 4-36 available from Xilinx, Inc., 2100 Logic Drive, San Jose, California, 95124.
Hoang Lan H.
Wu Paul Ying-Fung
Liu Justin
Paradise, III William L
Rose Kiesha
Smith Zandra V.
Xilinx , Inc.
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