Multi-chip device and method of fabrication employing leads over

Details Multi-chip device and method of fabrication employing leads over Multi-chip device and method of fabrication employing leads over

1997-08-14

1999-04-27

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257676, 257724, 438107, 438111, H01L 2314

Patent

active

058982205

ABSTRACT:
A device and method for increasing integrated circuit density comprising a pair of superimposed dies with a plurality of leads extending between the dies. The device is produced by providing a lower die which has a plurality of bond pads on a face side of the lower die. A layer of dielectric or insulative shielding is applied over the lower die face side. Leads are applied to an upper surface of the shielding layer. A plurality of lower die bond wires is attached between the lower die bond pads and an upper surface of their respective leads. A second layer of dielectric or insulative shielding is applied over the leads and the portion of the lower die bond wires extending over the lead upper surfaces. A back side of the upper die is adhered to an upper surface of the second shielding layer. A plurality of upper die bond wires are attached between a plurality of bond pads on a face side of the upper die and the upper surface of their respective leads.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5101324 (1992-03-01), Sato
patent: 5291061 (1994-03-01), Ball
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5479051 (1995-12-01), Waki et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5539250 (1996-07-01), Kitano et al.
patent: 5579208 (1996-11-01), Honda et al.
patent: 5689135 (1997-11-01), Ball

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