Multi-chip device and method for producing a multi-chip device

Details Multi-chip device and method for producing a multi-chip device Multi-chip device and method for producing a multi-chip device

2008-07-22

2008-07-22

Luu, Chuong A. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C257S690000, C257S713000

Reexamination Certificate

active

07402911

ABSTRACT:
The present invention relates to a multi-chip device comprising a substrate having a first surface on which a number of first contact elements is provided, a plurality of integrated circuit chips arranged in a chip stack which is arranged on a second surface of the substrate opposing the first surface, wherein each of the chips having a surface on which a number of second contact elements are provided, wherein a first one of the chips and the second contact elements thereon is arranged such that its second contact elements are uncovered by any of the chips or by the substrate and face towards the second surface of the substrate; and connecting elements which are arranged such as to connect at least one of the first contact elements of the substrate and at least one of the second contact elements of the first chip.

REFERENCES:
patent: 6531784 (2003-03-01), Shim et al.
patent: 7205656 (2007-04-01), Kim et al.

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