LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Selected: I

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IC chip mounting structure and display device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package and image display device incorporating same

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package having chip attached to and wire bonded within a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package having force-adjustable member between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package structure and underfill process

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package with cover

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip package with directly connected leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip packaging for reducing bond wire length

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip packaging for reducing bond wire length

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip with nanowires

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip with nanowires

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip, antenna, and manufacturing method of the IC chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC chip, IC assembly, liquid crystal device, and electric...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC contacts with palladium layer and flexible conductive epoxy b

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC die power connection using canted coil spring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

IC die support structures for ball grid array package...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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