IC chip packaging for reducing bond wire length

Details IC chip packaging for reducing bond wire length IC chip packaging for reducing bond wire length

2006-05-02

2006-05-02

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S691000, C257S786000

Reexamination Certificate

active

07038326

ABSTRACT:
An integrated circuit packaging assembly for reducing the length of bond wires transmitting radio frequency signals is disclosed herein. The die is offset in the packaging to position a subset of its bond pads in close proximity to package bond pads to allow for shorter bond wires, which reduces the inductive reactance that is induced in longer wires by high frequency signals. The subset of the bond pads is used for RF transmissions, while the other bond pads are used for direct current and low frequency signals.

REFERENCES:
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 5773896 (1998-06-01), Fujimoto et al.
patent: 5920117 (1999-07-01), Sono et al.
patent: 6046495 (2000-04-01), Urushima
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6163071 (2000-12-01), Yamamura
patent: 6268648 (2001-07-01), Fukutomi et al.
patent: 6294966 (2001-09-01), Huang et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6448659 (2002-09-01), Lee
patent: 6580163 (2003-06-01), Poulin
patent: 2002/0037598 (2002-03-01), Koh
patent: 2002/0145190 (2002-10-01), Fernandez et al.
patent: 2001-102515 (2001-04-01), None

Affiliated with

Also associated with

Rating

IC chip packaging for reducing bond wire length does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with IC chip packaging for reducing bond wire length, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC chip packaging for reducing bond wire length will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3588926