Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2002-01-07
2003-10-21
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S666000, C257S674000, C257S691000, C257S701000, C257S704000, C257S711000
Reexamination Certificate
active
06635953
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to an IC chip package, and more particularly to a small size IC chip package.
BACKGROUND OF THE INVENTION
FIG. 1
illustrates an IC chip package according to the prior art. The package
10
comprises generally a substrate
11
, a chip
12
, and a cover
13
. The substrate
11
has a top-open receiving chamber
14
and a certain number of connecting pads
16
of predetermined shapes arranged in the receiving chamber
14
at the bottom. The chip
12
is adhered to the central portion of the bottom of the receiving chamber
14
, and electrically connected to the connecting pads
16
by bonding wires
17
. The cover
13
closes the open side of the substrate
11
to protect the chip
12
against external impact or pollutant. The cover
13
shall be made of transparent material in case the chip
12
is a video chip.
In the aforesaid package
10
, the bottom of the receiving chamber
14
must receive the chip
12
and the connecting pads
16
of the substrate
11
, and sufficient space should be provided between the chip
12
and the wall of the receiving chamber
14
for the movement of the wire bonding tool
18
, and therefore, the area of the bottom of the receiving chamber
14
must be much greater than the chip. Due to the aforesaid reasons, this package does not meet the requirements for light, thin, small, and short electronic products.
Further, if the manufacturing of the substrate
11
of the aforesaid package
10
is based on plastic printing circuit board, moisture will pass to the inside of the receiving chamber
14
after a long use, thereby affecting the functioning of the chip
12
. In order to eliminate this problem, a waterproof isolating layer must be added to the bottom of the receiving chamber
14
. However, the installation of this isolating layer is complicated because the presence of the isolating layer must not interfere with the connection between the bonding wires
17
and the connecting pads
16
. Improper installation of the isolating layer cannot achieve the desired waterproof effect. Some manufacturers use ceramic material to make the substrate
11
instead of plastic material. However, the manufacturing cost of a ceramic printing circuit board is much higher than a plastic printing circuit. Further, ceramic material cannot isolate moisture completely.
SUMMARY OF THE INVENTION
The primary object of the present invention is to provide an IC chip package, which achieves the requirement for small dimensions.
It is another object of the present invention to provide an IC chip package, which effectively isolates moisture and, is inexpensive to manufacture.
To achieve these objects of the present invention, the IC chip package of the present invention comprises a substrate, the substrate having a top side, a bottom side, and a receiving chamber, the receiving chamber having an opening disposed in the top side, the top side of the substrate having a plurality of connecting pads arranged around the opening of the receiving chamber; a chip fixedly mounted in the receiving chamber of the substrate, the chip comprising a plurality of connecting pads; a plurality of bonding wires respectively electrically connected between the connecting pads at the substrate and the connecting pads at the chip; adhesive means provided in the connecting area between the bonding wires and the connecting pads of the substrate; and a cover fixedly fastened to the adhesive means to close the opening of the receiving chamber.
REFERENCES:
patent: 4646129 (1987-02-01), Yerman et al.
patent: 5296724 (1994-03-01), Ogata et al.
patent: 5532513 (1996-07-01), Smith et al.
patent: 5739584 (1998-04-01), Pasch
patent: 6111199 (2000-08-01), Wyland et al.
Louie Wai-Sing
Pham Long
Taiwan Electronic Packaging Co., Ltd.
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