IC chip package with cover

Details IC chip package with cover IC chip package with cover

2005-10-31

2008-08-26

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S678000, C257S680000, C257S704000, C257S773000, C257S774000, C257S783000

Reexamination Certificate

active

07417327

ABSTRACT:
An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

REFERENCES:
patent: 5278429 (1994-01-01), Takenaka et al.
patent: 5552635 (1996-09-01), Kim et al.
patent: 5554824 (1996-09-01), Ueda et al.
patent: 5729050 (1998-03-01), Kim
patent: 5814883 (1998-09-01), Sawai et al.
patent: 6117705 (2000-09-01), Glenn et al.
patent: 6201307 (2001-03-01), Terashi et al.
patent: 6396143 (2002-05-01), Kimbara et al.
patent: 6437412 (2002-08-01), Higuchi et al.
patent: 6518501 (2003-02-01), Kawahara et al.
patent: 6528869 (2003-03-01), Glenn et al.
patent: 6590269 (2003-07-01), Chuang et al.
patent: 6603183 (2003-08-01), Hoffman
patent: 6747346 (2004-06-01), Saito et al.
patent: 6870238 (2005-03-01), Exposito et al.
patent: 2003/0067750 (2003-04-01), Garcia
patent: 2004/0011699 (2004-01-01), Park
patent: 2004/0080044 (2004-04-01), Moriyama et al.
patent: 2004/0217454 (2004-11-01), Brechignac et al.
patent: 01200427.8 (2001-10-01), None

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