Highly reliable trench capacitor type memory cell
Highly resistive interconnects
Highly scalable FLASH EEPROM cell
Highly thermally conductive interconnect structure for intergrat
Highly tunable metal-on-semiconductor trench varactor
Highly uniform group III nitride epitaxial layers on 100...
Highly uniform group III nitride epitaxial layers on 100...
Highly uniform silicon carbide epitaxial layers
Highly-depleted laser doped semiconductor volume
Highly-doped P-type contact for high-speed, front-side...
Highly-oriented diamond film field-effect transistor
Highly-planar interlayer dielectric thin films in integrated cir
Hinge for micro-mirror devices
Hinged bonding of micromechanical devices
Hinged bonding of micromechanical devices
Hole capacitor for DRAM cell
Hole geometry of a semiconductor package substrate
Hole impact ionization mechanism of hot electron injection and f
Hole-injection type separate absorption and multiplication avala
Holistic thermal management system for a semiconductor chip