Holistic thermal management system for a semiconductor chip

Details Holistic thermal management system for a semiconductor chip Holistic thermal management system for a semiconductor chip

2007-11-30

2011-11-15

Mandala, Victor A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257SE23080, C257SE23082, C257SE23097, C257SE23111, C438S122000

Reexamination Certificate

active

08058724

ABSTRACT:
Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader.

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