Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2008-01-15
2008-01-15
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S204000
Reexamination Certificate
active
07319260
ABSTRACT:
A locked hinge based technique for controllably holding surface-micromachined modules off the edge of a substrate for subsequent processing. The mechanism enables reliable, accurate, and low-cost fabrication of even complex multi layer flip-chip MEMS devices using for example only a simple two-layer module processing sequence, a sequence involving materials already in use in the process. The sequence is also free from the interference of an alignment-hindering sacrificial substrate member. The technique is disclosed by way of a micromirror example and is arranged for convenient bypassing where use of another bonding technique is desired.
REFERENCES:
patent: 5994159 (1999-11-01), Aksyuk et al.
patent: 6300156 (2001-10-01), Decker et al.
patent: 6396975 (2002-05-01), Wood et al.
patent: 6396976 (2002-05-01), Little et al.
patent: 6404942 (2002-06-01), Edwards et al.
patent: 6470110 (2002-10-01), Lin
patent: 6600850 (2003-07-01), Fan
patent: 7096199 (2006-08-01), Lapstun et al.
patent: 2001/0040675 (2001-11-01), True et al.
patent: 2002/0021860 (2002-02-01), Ruan et al.
patent: 2002/0168144 (2002-11-01), Chen et al.
patent: 2007/0158769 (2007-07-01), You
AFMCLO/JAZ
Hollins Gerald B.
Le Thao P.
The United States of America as represented by the Secretary of
LandOfFree
Hinged bonding of micromechanical devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hinged bonding of micromechanical devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hinged bonding of micromechanical devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2771095