Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2008-01-15
2008-01-15
Le, Thao P. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S204000
Reexamination Certificate
active
10690159
ABSTRACT:
A locked hinge based technique for controllably holding surface-micromachined modules off the edge of a substrate for subsequent processing. The mechanism enables reliable, accurate, and low-cost fabrication of even complex multi layer flip-chip MEMS devices using for example only a simple two-layer module processing sequence, a sequence involving materials already in use in the process. The sequence is also free from the interference of an alignment-hindering sacrificial substrate member. The technique is disclosed by way of a micromirror example and is arranged for convenient bypassing where use of another bonding technique is desired.
REFERENCES:
patent: 5994159 (1999-11-01), Aksyuk et al.
patent: 6300156 (2001-10-01), Decker et al.
patent: 6396975 (2002-05-01), Wood et al.
patent: 6396976 (2002-05-01), Little et al.
patent: 6404942 (2002-06-01), Edwards et al.
patent: 6470110 (2002-10-01), Lin
patent: 6600850 (2003-07-01), Fan
patent: 7096199 (2006-08-01), Lapstun et al.
patent: 2001/0040675 (2001-11-01), True et al.
patent: 2002/0021860 (2002-02-01), Ruan et al.
patent: 2002/0168144 (2002-11-01), Chen et al.
patent: 2007/0158769 (2007-07-01), You
AFMCLO/JAZ
Hollins Gerald B.
Le Thao P.
The United States of America as represented by the Secretary of
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