LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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Heat spreader and semiconductor device and package using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure

Reexamination Certificate

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Heat spreader and semiconductor device package having the same

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Reexamination Certificate

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Heat spreader and stiffener having a stiffener extension

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader as mechanical reinforcement for ultra-thin die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader ball grid array (HSBGA) design for low-k...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader for a multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Heat spreader for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

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Heat spreader having holes for rivet-like adhesive connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader hole pin 1 identifier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Heat spreader in a flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Heat spreader interconnect for thermally enhanced PBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Heat spreader package and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader semiconductor device with heat spreader and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Patent

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Heat spreader structures in scribe lines

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Reexamination Certificate

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Heat spreader suitable for use in semiconductor packages having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Patent

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Heat spreader with a placement recess and bottom saw-teeth for c

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Patent

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Heat spreader with down set leg attachment feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Heat spreader with spring IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Heat spreader, heat sink, heat exchanger and PDP chassis base

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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