Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-02-20
2007-02-20
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S720000, C257S790000, C257S704000, C257S738000, C438S122000, C174S050510
Reexamination Certificate
active
10718192
ABSTRACT:
A method of forming a heat spreader ball grid array package, and the resultant heat spreader ball grid array package, comprising the following steps. A semiconductor chip affixed to a ball grid substrate is provided. The semiconductor chip over the ball grid substrate is encased with a molding compound. A heat spreader is mounted over the ball grid substrate and spaced apart from the molding compound to form a gap. Thermal grease is placed into the gap, at least between the heat spreader and the molding compound, to form the heat spreader ball grid array package. It is also possible to place thermal grease over the molding compound and then mounting the heat spreader over the ball grid substrate.
REFERENCES:
patent: 4711804 (1987-12-01), Burgess
patent: 4748495 (1988-05-01), Kucharek
patent: 5175612 (1992-12-01), Long et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5331205 (1994-07-01), Primeaux
patent: 5346743 (1994-09-01), Uchida et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5574630 (1996-11-01), Kresge et al.
patent: 5585671 (1996-12-01), Nagesh et al.
patent: 5785799 (1998-07-01), Culnane et al.
patent: 5917702 (1999-06-01), Barrow
patent: 5969947 (1999-10-01), Johnson et al.
patent: 5977633 (1999-11-01), Suzuki et al.
patent: 6309908 (2001-10-01), Sarihan et al.
patent: 6362530 (2002-03-01), Lee et al.
patent: 6376907 (2002-04-01), Takano et al.
patent: 6462410 (2002-10-01), Novotny et al.
patent: 6492724 (2002-12-01), Gaynes et al.
patent: 6610635 (2003-08-01), Khatri
patent: 6737755 (2004-05-01), McLellan et al.
patent: 6784541 (2004-08-01), Eguchi et al.
patent: 2001/0004131 (2001-06-01), Masayuki et al.
patent: 2002/0079573 (2002-06-01), Akram
patent: 2003/0180484 (2003-09-01), Imai et al.
patent: 1397999 (2003-02-01), None
patent: 61019154 (1986-01-01), None
patent: 2003069263 (2003-03-01), None
Taiwan Patent Office Action.
Taiwan Office Action issued Apr. 19, 2006.
China Office Action mailed Dec. 1, 2006.
Huang Yung-Sheng
Kuo Yian-Liang
Lin Yu-Ting
Chu Chris C.
Parker Kenneth
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
LandOfFree
Heat spreader ball grid array (HSBGA) design for low-k... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat spreader ball grid array (HSBGA) design for low-k..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat spreader ball grid array (HSBGA) design for low-k... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3858476