Heat spreader as mechanical reinforcement for ultra-thin die

Details Heat spreader as mechanical reinforcement for ultra-thin die Heat spreader as mechanical reinforcement for ultra-thin die

2006-06-30

2011-11-22

Williams, A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23087, C257S678000, C257S712000, C257S713000, C257S711000, C257S710000, C257S706000, C257S778000, C257S737000, C257S738000, C257S780000

Reexamination Certificate

active

08063482

ABSTRACT:
A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form a HS-reinforced thin die.

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