Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1998-11-27
2000-05-02
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257690, 257706, 257730, 257784, H01L 2348
Patent
active
060576014
ABSTRACT:
The present invention discloses a new semiconductor ball grid array package for integrated circuits which have input and output counts higher than 250. The speed and performance characteristics of the semiconductor device contained in the package assembly are optimized while the packaging structure is simplified by utilizing only one dielectric layer and regular printed circuit board fabrication process. The complexities and higher cost for production of a multiple layer substrate for high-density interconnection configuration are thus resolved. The improved package assembly is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide interlayer connections. The package assembly applies a cavity down configuration with an integrated heat spreader attached. The IC wire bonds within the cavity are sealed with an organic encapsulant. In addition to the benefits of high performance low cost, the improved circuit structure and package layout provide flexibility allowing higher degree of freedom for selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
REFERENCES:
patent: 5397921 (1995-03-01), Karnezos
patent: 5541450 (1996-07-01), Jones et al.
patent: 5729050 (1998-03-01), Kim
patent: 5819398 (1998-10-01), Wakefield
patent: 5825084 (1998-10-01), Lau et al.
patent: 5834839 (1998-11-01), Mertol
patent: 5895973 (1999-04-01), Fessenden
Lau et al, Electrical Design of a Cost-Effective Plastic BGA Package, IEEE Part B, vol.21, No.1, Feb. 1998.
Cheng Chen-Hua
Lau John H.
Tseng Tzyy Jang
Clark Sheila V.
Express Packaging Systems, Inc.
Lin Bo-In
Tran H. D.
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