Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-05-16
2006-05-16
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S712000, C257S713000, C257S717000, C257S720000, C257S701000, C257S707000, C257S710000, C257S704000, C257S668000, C257S700000, C257S696000, C257S698000, C361S720000, C361S704000, C361S707000, C361S700000, C361S785000, C174S260000, C174S261000
Reexamination Certificate
active
07045890
ABSTRACT:
A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.
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“Method of Heat Sinking an Array of Discrete Electronic Packages”, 2244 Research Disclosure (1992) Oct. 1992, No. 342, Emsworth, GB.
Banerjee Koushik
Frutschy Kristopher
Sathe Ajit
Xie Hong
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
Williams Alexander Oscar
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