Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate
2006-10-17
2006-10-17
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With heat sink embedded in encapsulant
C257S706000, C257S707000
Reexamination Certificate
active
07122911
ABSTRACT:
The present invention relates to a heat spreader and a semiconductor device package having the same. The semiconductor device package comprises a substrate, a semiconductor die, a plurality of bonding wires, a heat spreader, a molding compound and a plurality of solder bumps. The die is mounted on the top surface of the substrate. The bonding wires are used for electrically connecting the substrate and the semiconductor die, and each of the bonding wires has a highest portion. The heat spreader has at least one groove on a bottom surface thereof in the position corresponding to the highest portion of the bonding wires. The molding compound encapsulates the substrate, the semiconductor die and the heat spreader. As a result, the groove of the heat spreader can prevent the bonding wires from touching the heat spreader.
REFERENCES:
patent: 5289039 (1994-02-01), Ishida et al.
patent: 5977626 (1999-11-01), Wang et al.
patent: 2002/0020926 (2002-02-01), Liu et al.
patent: 91100093 (1991-07-01), None
English Abstract of Taiwan 91100093 dated Jul. 1, 1991.
Advanced Semiconductor Engineering Inc.
Huynh Andy
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