LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Grooved gate transistor having source and drain diffused layers

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Grooved planar DRAM transfer device using buried pocket

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Grooved semiconductor die for flip-chip heat sink attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Grooved substrates for uniform underfilling solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Grooving bumped wafer pre-underfill system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ground arch for wirebond ball grid arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Punchthrough structure device – Punchthrough region fully depleted at zero external applied...

Ground compatible inhibit circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Ground plane for exposed package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ground plane for integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Ground-enhanced semiconductor package and lead frame for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Ground-plane device with back oxide topography

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Ground-signal-ground pad layout for device tester structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Grounded body SOI SRAM cell

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Grounded body SOI SRAM cell

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Grounded embedded flip chip RF integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Grounded fill in a large scale integrated circuit