LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Capacitors, methods of forming capacitors and integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Capacitors, methods of forming capacitors, and DRAM memory...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface

Capactive connectors with enhanced capacitive coupling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Capcitively coupled bi-directional data and power transmission s

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Capillary underfill of stacked wafers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Capillary underflow integral heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Capillary-flow underfill compositions, packages containing...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – With lattice constant mismatch

Capped anneal

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capped copper electrical interconnects

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Capped dual metal gate transistors for CMOS process and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capped solder bumps which form an interconnection with a tailore

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Capping layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capping layer for improved silicide formation in narrow...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Capping layer in interconnect system and method for bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Capsule for at least one high power transistor chip for high...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Capture of residual refractory metal within semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Capture of residual refractory metal within semiconductor...