Capillary underfill of stacked wafers

Details Capillary underfill of stacked wafers Capillary underfill of stacked wafers

2011-03-08

2011-03-08

Kebede, Brook (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE25013, C257SE21122

Reexamination Certificate

active

07902675

ABSTRACT:
A plurality of wafers are aligned and stacked on a thermally variable rotary table, the table and stack are rotated, and an underfill material is disposed and cured between wafers in the stack, bonding the wafers. Corresponding wafer portions of the plurality of wafers in the stack may be singulated from the stack, and may comprise semiconductor device packages either individually or when coupled with a substrate.

REFERENCES:
patent: 6967412 (2005-11-01), Standing
patent: 6984873 (2006-01-01), Kloster et al.
patent: 7355274 (2008-04-01), Lim
patent: 2005/0017338 (2005-01-01), Fukazawa

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