Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1996-03-25
1998-01-06
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257766, H01L 2348
Patent
active
057058571
ABSTRACT:
The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semiconductor substrate are capped to obtain a robust electrical interconnect structure. A method for obtaining such capped copper electrical interconnect structure is also disclosed. These capped interconnects can be a single layer or multi-layer structures. Similarly, the interconnect structure that is being capped can itself be composed of single or multi-layered material.
REFERENCES:
patent: 4394223 (1983-07-01), Hall
patent: 4810332 (1989-03-01), Pan
patent: 5071518 (1991-12-01), Pan
patent: 5132775 (1992-07-01), Brighton et al.
patent: 5272376 (1993-12-01), Veno
patent: 5298687 (1994-03-01), Rapoport et al.
patent: 5326412 (1994-07-01), Schreiber et al.
patent: 5382447 (1995-01-01), Kaja et al.
patent: 5545927 (1996-08-01), Farooq
"Alternative Ceramic Plate-Up Process", IBM Tech. Disc. Bulletin, vol. 32, No. 10A, Mar. 1990, p. 442.
Messner et al., Thin Film Multichip Modules,ISBN O-930815-33-5, 1992 by International Society for Hybrid Microelectronics, Dec. 1992.
Farooq Mukta Shaji
Kaja Suryanarayana
Perfecto Eric Daniel
White George Eugene
Ahsan Aziz M.
International Business Machines - Corporation
Prenty Mark V.
LandOfFree
Capped copper electrical interconnects does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capped copper electrical interconnects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capped copper electrical interconnects will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2331879