Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface
Reexamination Certificate
2011-01-04
2011-01-04
Geyer, Scott B (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
With textured surface
Reexamination Certificate
active
07863743
ABSTRACT:
A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.
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Krishnamoorthy Ashok V.
Popovic Darko R.
Shi Jing
Geyer Scott B
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
Stupp Steven E.
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