Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-05-24
2011-05-24
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C428S414000, C525S481000, C525S487000, C525S523000
Reexamination Certificate
active
07948090
ABSTRACT:
An underfill composition is formulated to increase the surface tension thereof for use in capillary underfilling of an integrated circuit die that is coupled to a mounting substrate. A method includes mixing a surface tension-increasing additive with a bulk polymer and a hardener and allowing the underfill composition to flow between the integrated circuit die and the mounting substrate. An article is achieved by the method. The article can be assembled into a computing system.
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Jayaraman Saikumar
Manepalli Rahul N.
Chambliss Alonzo
Greaves John N.
Intel Corporation
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