Ball grid array package emulator
Bare chip carrier and method for manufacturing semiconductor...
Bipolar transistor characterization apparatus with lateral...
Bipolar transistor test structure with lateral test probe pads
Bond quality indication by bump structure on substrate
Bonding pad with separate bonding and probing areas
Breakdown evaluating test element
Bumped semiconductor component having test pads, and method...
Burn-in socket used in a burn-in test for semiconductor chips