Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2007-06-05
2008-11-11
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257S778000, C257S797000, C257SE23179
Reexamination Certificate
active
07449716
ABSTRACT:
A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.
REFERENCES:
patent: 5707902 (1998-01-01), Chang et al.
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 6972490 (2005-12-01), Chang et al.
patent: 2005/0224991 (2005-10-01), Yeo
patent: 2008/0012150 (2008-01-01), Yang
Chang Shyh-Ming
Chen Ming-Yao
Tsang Ngai
Yang Sheng-Shu
Au Optronics Corporation
Chi Mei Optoelectronics Corporation
Chunghwa Picture Tubes, LTD.
Hannstar Display Corporation
Industrial Technology Research Institute
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