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Microelectronic component assemblies and microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Microelectronic component assemblies and microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Microelectronic die assembly having thermally conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Microelectronic package having a compliant layer with bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Microelectronic packages having an array of resilient leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Reexamination Certificate

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Microelectronic substrate with integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Microelectronic substrates with integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Miniaturized integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Modified bus bar with Kapton tape or insulative material on...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Modified bus bar with Kapton.TM. tape or insulative material on

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Modified lead finger for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Modified lead frame for improved parallelism of a die to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Modular semiconductor power device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reissue Patent

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Modularized die stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Modularly expandable multi-layered semiconductor component

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Moisture relief for chip carriers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Moisture resistant integrated circuit leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Mold for forming molding member and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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