Moisture resistant integrated circuit leadframe package

Details Moisture resistant integrated circuit leadframe package Moisture resistant integrated circuit leadframe package

2006-11-14

2006-11-14

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S669000, C257S674000

Reexamination Certificate

active

07135760

ABSTRACT:
A leadframe for a semiconductor die includes signal leads, ground leads, and a die support holder for supporting the semiconductor die. The die support holder has opposite surfaces and side edges therebetween. The opposite die support holder surfaces are smaller in transverse extent than the semiconductor die for supporting the die on one of the opposite die support holder surfaces such that the die extends beyond the side edges of the die support holder.

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