Modified lead finger for wire bonding

Details Modified lead finger for wire bonding Modified lead finger for wire bonding

1999-03-30

2000-06-13

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257672, 257673, 257780, 257784, H01L 23495, H01L 2348, H01L 2352, H01L 2940, H05K 502

Patent

active

060752815

ABSTRACT:
A lead frame equipped with modified lead fingers which have inclined tip portions for achieving an improved wire bond is provided. The inclined tip portions on the lead fingers can be formed in a stamping process with an angle on a top surface of the inclined tip portion measured at smaller than 30.degree. from a horizontal plane of the lead finger. It is preferred that the inclined angle should be between about 5.degree. and about 30.degree., and more preferred that the angle should be between about 5.degree. and about 20.degree.. A wedge bond formed on the inclined tip portion of a lead finger has improved thickness and thermal stress endurance. The thermal stress endurance may be improved by at least 20% and preferably by at least 50% when tested in a thermal cycling test between 150.degree. C. and -65.degree. C.

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