Moisture relief for chip carriers

Details Moisture relief for chip carriers Moisture relief for chip carriers

1995-06-12

1998-02-24

Wallace, Valencia Martin

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257676, 257680, 257690, H01L 23495, H01L 2302, H01L 2348

Patent

active

057214506

ABSTRACT:
An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.

REFERENCES:
patent: 4760440 (1988-07-01), Bigler et al.
patent: 4866506 (1989-09-01), Namba et al.
patent: 4910581 (1990-03-01), Baird
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5296738 (1994-03-01), Freyman et al.

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