Modified bus bar with Kapton.TM. tape or insulative material on

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257676, 438123, H01L 23495

Patent

active

057809232

ABSTRACT:
A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.

REFERENCES:
patent: 4965654 (1990-10-01), Karner et al.
patent: 5294827 (1994-03-01), McShane
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5442233 (1995-08-01), Anjoh et al.
patent: 5457341 (1995-10-01), West
patent: 5477080 (1995-12-01), Ishisaka et al.
patent: 5559364 (1996-09-01), Hojyo

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