Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2006-09-29
2009-12-01
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S706000, C257S707000, C257S719000, C257SE23051, C257SE23101
Reexamination Certificate
active
07626251
ABSTRACT:
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The thermally conductive element has lateral dimensions smaller than, substantially equal to, or larger than lateral dimensions of the die by up to a maximum amount, wherein the maximum amount is adapted to allow a mounting of the die assembly to a package substrate.
REFERENCES:
patent: 6114761 (2000-09-01), Mertol et al.
patent: 7148122 (2006-12-01), Shaheen et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2007/0216009 (2007-09-01), Ng
patent: 2007/0262421 (2007-11-01), Lehman et al.
He Dongming
Hu Chuan
Lu Daoqiang
Blakey Sokoloff Taylor & Zafman LLP
Clark Jasmine J
Intel Corporation
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