Microelectronic packages having an array of resilient leads

Details Microelectronic packages having an array of resilient leads Microelectronic packages having an array of resilient leads

2005-05-10

2005-05-10

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

C257S666000, C257S688000, C257S690000

Reexamination Certificate

active

06891255

ABSTRACT:
A connection component including a flexible substrate having a top surface and a bottom surface, a layer of a compliant, dielectric material overlying the top surface of the substrate, the compliant material layer having a top surface remote from the substrate, an array of flexible, conductive leads having first ends attached to terminals accessible at the bottom surface of the substrate and second ends adjacent the top surface of the compliant layer, wherein each lead comprises a core of a first conductive material surrounded by a layer of a second conductive material, the second conductive material having a greater yield strength than the first conductive material.

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