Microelectronic package having a stiffening element and...

Details Microelectronic package having a stiffening element and... Microelectronic package having a stiffening element and...

2008-05-13

2008-05-13

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S787000, C257SE23031, C257SE23043, C257SE23046, C257SE23061, C438S106000, C438S121000, C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

07372133

ABSTRACT:
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer comprising a paddle portion and a contact portion including contact leads; a die mounted onto the paddle portion; wirebonds connected between the die and respective ones of the contact leads; an overmold encapsulating the die, the paddle portion, the contact leads and the wirebonds; and a stiffening element encapsulated in the overmold and unconnected to electrical pathways within the leadframe package.

REFERENCES:
patent: 6498099 (2002-12-01), McLellan et al.
patent: 6655022 (2003-12-01), Eskildsen et al.
patent: 6717822 (2004-04-01), Miks et al.
patent: 7179682 (2007-02-01), Foong
patent: 7226811 (2007-06-01), McLellan et al.
patent: 2002/0149027 (2002-10-01), Takahashi et al.
patent: 2003/0155636 (2003-08-01), Cobbley et al.
patent: 2005/0029657 (2005-02-01), Khan et al.
patent: 2005/0073035 (2005-04-01), Moxham
patent: 2005/0179143 (2005-08-01), Moxham

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