Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-08-30
2011-08-30
Toledo, Fernando L (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE33056, C438S027000, C438S029000
Reexamination Certificate
active
08008755
ABSTRACT:
Provided is a method of manufacturing a light emitting diode (LED) package, the method including the steps of: preparing a package substrate having an LED chip mounted thereon; preparing a mold which has a convex portion, a plane portion extending outward from the convex portion, and a projecting portion formed on the lower surface of the plane portion, the projecting portion having a sharp end; engaging the mold with the package substrate such that the projecting portion is contacted with the surface of the package substrate; and filling transparent resin into the convex portion.
REFERENCES:
patent: 2003/0168720 (2003-09-01), Kamada
patent: 2008/0268559 (2008-10-01), Jung
patent: 2009/0162957 (2009-06-01), Joung
patent: 2010/0047941 (2010-02-01), Lee et al.
patent: 2010/0053978 (2010-03-01), Lee
patent: 2007-184310 (2007-07-01), None
patent: 10-2006-0135498 (2006-12-01), None
patent: 10-2007-0008269 (2007-01-01), None
Korean Notice of Allowance dated Dec. 24, 2009 and issued in corresponding Korean Patent Application 10-2007-0135476.
Samsung LED Co., Ltd.
Toledo Fernando L
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