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Tape carrier type semiconductor device with gold/gold...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape carrier type semiconductor device, method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape carrier, semiconductor assembly, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape circuit substrate and semiconductor apparatus employing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Tape circuit substrate and semiconductor chip package using...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Tape mounted semiconductor apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Tape package having test pad on reverse surface and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape under frame for conventional-type IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Tape under frame for conventional-type IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape under frame for lead frame IC package assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape wiring substrate and tape package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Tape-carrier-package semiconductor device and a liquid...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Tape-fixed leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Patent

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Tapered isolated metal profile to reduce dielectric layer cracki

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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TCP TAB design with radial outer leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Teardrop shaped lead frames

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Technique for attaching die to leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Technique for attaching die to leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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